SUBSTRATE FOR POWER MODULE, AND POWER MODULE

摘要

Disclosed is a substrate for power modules which comprises a plate-shaped substrate main body, one surface of which is a mounting surface on which a semiconductor element is to be mounted, and an insulating layer formed on the other surface of the substrate main body, characterized in that the substrate main body is constituted of a metal-based composite plate comprising a metal-based composite material comprising a carbonaceous member and a metal filled thereinto.