APPARATUS AND METHOD FOR TREATING SUBSTRATE USING PLASMA

摘要

PURPOSE: A plasma board processing unit and a method for evaporating a thin film are provided to multiply thin film evaporating velocity by multiplying plasma-generating density by supplying the power to a main electrode unit and a sub electrode unit, thereby improving the quality of a plasma board processing. CONSTITUTION: The fluid for plasma-generating is inserted in a chamber(140) and the chamber stores a substrate. A main electrode unit comprises one and more electrodes which is vertically arranged to be faced each other within the chamber. A sub electrode unit comprises one and more electrodes which is horizontally arranged to be faced each other within the chamber. A power supply unit supplies the power to the main electrode unit and the sub electrode unit.