| 摘要 |
PURPOSE: An image picking up component is provided to uniformly diffuse heat to a surface direction and to increase the radiation capability. CONSTITUTION: An imaging device(2) includes a light incident surface. The image device is a CMOS image sensor. A thermally conductive sheet(3) is installed in the rear side of the image device and radiates heat from the image device. The thermally conductive sheet contains boron nitride particle of a sheet form. |
