| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting structure capable of reducing a mounting area in mounting a through-hole type electronic component and a surface mounting type electronic component on a printed board, and easily arranging the respective components. SOLUTION: In this electronic component mounting structure for subjecting a through-hole type electronic component including a set of leads and a surface mounting type electronic component to parallel connection on a board, the surface mounting type electronic component is mounted on a second mounting surface on the back side with respect to a first mounting surface of the board mounted with the through-hole type electronic component and arranged among the set of leads projecting from the second mounting surface side by penetrating the board, and the projecting height, from the second mounting surface, of the set of leads of the through-hole type electronic component is set nearly to the same dimension as that of the height of the surface mounting type electronic component from the second mounting surface. COPYRIGHT: (C)2011,JPO&INPIT
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