| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board excellent in conductor circuit precision, and the circuit board. SOLUTION: The method for manufacturing a circuit board 1 includes steps of: preparing a lamination board 10 of a base material 105 and one metallic layer 101 formed on at least one surface of the base material 105; forming a first resist layer 22 having openings on the surface of the metallic layer 101; forming a conductor 31 by plating each opening of the first resist layer 22; removing the first resist layer 22; forming a second resist layer 51 so as to cover entire surfaces of the metallic layer 101 and the conductor 31; removing a portion of the second resist layer 51 to expose the metallic layer 101 while covering the side surface and the top surface of the conductor with the second resist layer; and removing the exposed metallic layer 101 by etching to expose the surface of the base material 105. COPYRIGHT: (C)2011,JPO&INPIT
|
