发明名称 |
THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES |
摘要 |
A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements.
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申请公布号 |
US2011188210(A1) |
申请公布日期 |
2011.08.04 |
申请号 |
US20100752345 |
申请日期 |
2010.04.01 |
申请人 |
NATIONAL CHIP IMPLEMENTATION CENTER NATIONAL APPLIED RESEARCH LABORATORIES |
发明人 |
HUANG CHUN-MING;WEY CHIN-LONG;WU CHIEN-MING;YANG CHIH-CHYAU;CHEN SHIH-LUN;CHEN CHI-SHI;LIN CHI-SHENG |
分类号 |
H05K1/14;H05K7/00 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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