| 摘要 |
<p>As the weight, thickness, and size of a portable electronic device are reduced, a conventional method for bonding a FPC to a circuit board using a connector and/or solder, ACF, NCF, etc., is not reasonable because the component cost is high, the number of mounting processes is large, the mounting time is long, the mounting temperature is high, the bonding thrust is high, the bonding resistance is large, and the repair property is low in the conventional method. The bonding operation for a lightweight, thin, and small electronic device can be realized at a low cost, a small number of processes, a short period of time, a low temperature, a low load, a low resistance, and a high repair property, because a heating ultrasonic horn shaped like a projected blade having a tip perpendicular to the vibration direction and a section perpendicular to the pressing surface, is disposed so that the heating ultrasonic horn is vibrated in a direction parallel to the bonding surface and the electrode direction; the electrodes of the FPC and the circuit are metal-bonded by overlapping the electrodes before heating and vibrating the electrodes while a predetermined pressure is vertically applied to the bonding surface; and the FPC and the PCB are bonded using resin.</p> |
