| 摘要 |
<p>PURPOSE: An LED package and a manufacturing method thereof are provided to increase optical extraction efficiency by having higher reflectivity in the center of an upper surface part, which is adjacent to an LED chip, in a body part than at least in a part of the rest in the body part. CONSTITUTION: A lead frame(110) is provided a power source. A LED chip is electrically connected to the lead frame. A mounting unit, in which an LED chip is arranged, is formed in a heat slug and emits heat, which is generated in the LED chip, to the outside. A body unit(160) covers at least a part of the outer circumference of the heat slug. At least the outer area of a part of the body unit has higher heat resistance than the inner part.</p> |
