发明名称 |
COPPER WIRING SURFACE PROTECTIVE LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT |
摘要 |
A copper wiring material surface protective liquid for production of a semiconductor device is provided, containing an oxyalkylene adduct of an acetylenediol containing an acetylenediol having an oxyalkylene having 2 or 3 carbon atoms added thereto. A method for producing a semiconductor circuit device is provided, containing: forming an insulating film and/or a diffusion preventing film on a silicon substrate; then forming a copper film by a sputtering method; then forming a copper wiring containing 80% by mass or more of copper thereon by a plating method; and flattening the wiring by a chemical mechanical polishing (CMP) method, thereby providing a semiconductor substrate containing a copper wiring, the semiconductor substrate having an exposed surface of a copper wiring material being treated by making in contact with the copper wiring material surface protective liquid. |
申请公布号 |
KR20110088496(A) |
申请公布日期 |
2011.08.03 |
申请号 |
KR20117006319 |
申请日期 |
2009.09.02 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
YAMADA KENJI;SHIMADA KENJI;MATSUNAGA HIROSHI |
分类号 |
H01L21/3205;H01L21/28;H01L21/304 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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