发明名称 TEMPERATURE CONTROL METHOD, METHOD OF OBTAINING A TEMPERATURE CORRECTION VALUE, METHOD OF MANUFATURING A SEMICONDUCTOR DEVICE AND SUBSTRATE TREATMENT APPARATUS
摘要 PURPOSE: A method for controlling temperature, method for obtaining a temperature correction value, a method for controlling a semiconductor device, and apparatus for processing a substrate are provided to at least correspond the temperature of an heat treatment with target temperature by efficiently using the temperature detected from the detection means and preparing a detection means which has over the number of partitions. CONSTITUTION: A target temperature is given with a temperature gradient corresponding to a zone in a heat treating furnace(1) in which a heat treatment area(9) is classified into a plurality of zones and a plurality of heaters(20a,20b,20c) is controlled according to the target temperature. A heat interference matrix, which shows correlation with the temperature detected from a plurality of profile temperature sensors(5) in the heat treating furnace and the amount of power supply to the heater, is obtained. A virtual temperature is produced based on the weighting factor, calculated from the heat interference matrix, and the detection temperature from a profile temperature sensor. A heater is controlled so that the virtual temperature corresponds to the target temperature.
申请公布号 KR20110086793(A) 申请公布日期 2011.08.01
申请号 KR20110072790 申请日期 2011.07.22
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 YAMAGUCHI HIDETO
分类号 H01L21/324;H01L21/02 主分类号 H01L21/324
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