发明名称 PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING
摘要 PROCESS FOR OPTICALLY TRANSPARENT VIA FILLINGA method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.Fig 1
申请公布号 SG172615(A1) 申请公布日期 2011.07.28
申请号 SG20110036860 申请日期 2007.05.24
申请人 ELECTRO SCIENTIFIC INDUSTRIES, INC. 发明人 NASHNER, MICHAEL, S.;HOWERTON, JEFFREY;LU, WEIXIONG
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