| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for stably manufacturing a highly reliable power module for its characteristics. <P>SOLUTION: Provided is the method for manufacturing a power module 1 by stacking a cooler 5, an insulating resin sheet 4, a heat dissipation block 3, and a semiconductor chip 2. In this method, a first insulating resin sheet 41 is initially thermo-compression bonded on the cooler 5 to form a lower layer of the insulating resin sheet 4. Then, a second insulating resin sheet 42 for forming an upper layer of the insulating resin sheet 4 is interposed between the first insulating resin sheet 41 and the heat dissipation block 3, and the second insulating resin sheet 42 is thermo-compression bonded to the first insulating resin sheet 41, and the heat dissipation block 3 is thermo-compression bonded to the second insulating resin sheet 42. The semiconductor chip 2 is bonded by solder on the heat dissipation block 3. In this way, bonding failure on each bonding interface is prevented, thereby to prevent breakdown of the insulating resin sheet 4. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
