INKJET PRINT HEAD, WAFER LEVEL PACKAGE FOR INKJET HEAD, AND METHOD FOR PRODUCING INKJET PRINT HEAD

摘要

PROBLEM TO BE SOLVED: To provide an inkjet print head, a wafer level package for an inkjet head, and a method for producing an inkjet print head. SOLUTION: The inkjet print head includes an ink head provided with a nozzle for discharging an ink inside the ink head to the outside by the drive of a piezoelectric actuator mounted on one side, and a chipping prevention part provided with a cut part which is cut to a height lower than the height of the nozzle and formed on the side surface of the ink head. COPYRIGHT: (C)2011,JPO&INPIT