A metallic composition including a solvent and a plurality of metal nanoparticles dispersed therein is formulated such that curing of the metallic composition on a substrate provides a metallic conductor with a resistivity of about 5x10-4 Omega.cm or less. Electrical components of an assembly can be interconnected by a metallic conductor formed by curing the metallic composition on a substrate. A metallic composition including metal nanoparticles can be deposited on a substrate and solidified. The metallic composition can be contacted with a metal wire before or after solidification of the metallic composition and secured to the solidified metallic composition.
申请公布号
EP2301043(A4)
申请公布日期
2011.07.27
申请号
EP20090774505
申请日期
2009.07.02
申请人
APPLIED NANOTECH HOLDINGS, INC.;ISHIHARA CHEMICAL CO., LTD