| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem of generation of chip cracks in performing a dicing process using a blade in a thickness reduced state of a semiconductor wafer for obtaining a semiconductor chip. <P>SOLUTION: In the process of dicing the semiconductor wafer 11, in dicing in a first direction 11k (a Y-direction in Fig.12) along a first straight line 11m, the blade is advanced from a first point 11h positioned on a first part 11g toward a second point 11j opposed to the first point 11h via a second straight line 11n passing through a central point 11f of the semiconductor wafer 11 to cut the semiconductor wafer 11. <P>COPYRIGHT: (C)2011,JPO&INPIT |
