发明名称 HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS
摘要 A heat treatment apparatus has a substrate holder with two holder constituting bodies that each have a plurality of columns and substrate holding sections. One of the holder constituting bodies holds substrates so that their front surfaces face upward, while the other holds the substrates so that their back surfaces face upward. At least one of the holder constituting bodies moves vertically to change the positions of the holder constituting bodies relative to each other. A distance between one of a first pair of vertically-adjacent substrates with respective front surfaces facing each other and the other of the first pair of substrates is set to ensure treatment uniformity and to be larger than a distance between one of a second pair of vertically-adjacent substrates with their respective back surfaces facing each other and the other of the second pair of substrates.
申请公布号 US2011162633(A1) 申请公布日期 2011.07.07
申请号 US20110987406 申请日期 2011.01.10
申请人 TOKYO ELECTRON LIMITED 发明人 INOUE HISASHI;MATSUMOTO SHUNICHI;TAKEUCHI YASUSHI
分类号 F24C1/00 主分类号 F24C1/00
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