| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device that has small variation in cumulative pitch of external connection terminals resulting from heating during semiconductor element mounting, can be improved in connectivity with external equipment, can suppress formation of conductive foreign matters, and can suppress unstable behavior of a wiring pattern handling electric signals to the signals not to cause that, and to provide a semiconductor device using the same. SOLUTION: The tape carrier for the semiconductor device is constituted by forming a fine wiring pattern 3 on a base 2, and does not have a device hole for positioning a semiconductor element 4 to be mounted. The wiring pattern 3 includes wiring 5 which has, at one end, internal connection terminals 6 connected to electrode terminals 16 of the semiconductor element 4, and, at the other end, external connection terminals 7a and 7b connected to the external equipment. On a reverse surface of the base 2, a nonconductive member 11 is provided which has a coefficient of thermal expansion close to that of a wiring board constituting the external equipment and having wiring 5 connected to the external connection terminals 7a and 7b. COPYRIGHT: (C)2011,JPO&INPIT
|
