PURPOSE: A light emitting diode package is provided to improve photonic efficiency without disturbing the propagation of light by thinning a reflection layer than the active layer of a light emitting diode chip. CONSTITUTION: A light emitting diode chip(110) is arranged on one side of a lead frame. An encapsulant(140) encapsulates the light emitting diode chip. The encapsulant includes one or more fluorescent substances. A reflection layer(105) is formed on an area without the light emitting diode chip on one side of the lead frame and includes barium sulfate.
