发明名称 |
Light emitting semiconductor device and method for manufacturing the same |
摘要 |
<p>There is provided a semiconductor device mounted with a light emitting element, which can be downsized easily, improve light emitting efficiency and be formed easily, and a method for manufacturing the semiconductor device effectively. The semiconductor device includes a substrate, a light emitting element mounted on the substrate by flip chip bonding, a sealing structure sealing the light emitting element and a phosphor film which is formed on an internal surface of the sealing structure. The sealing structure includes a blocking portion which is formed integrally with the substrate so as to surround the light emitting element on the substrate and functions as a reflector that reflects a light emitted from the light emitting element and a cover portion which is arranged on the top of the blocking portion and is bonded to the blocking portion.
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申请公布号 |
EP1804302(A3) |
申请公布日期 |
2011.06.29 |
申请号 |
EP20060026701 |
申请日期 |
2006.12.22 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SUNOHARA, MASAHIRO;HIGASHI,MITSUTOSHI;TAGUCHI, YUICHI;SAKAGUCHI, HIDEAKI;SHIRAISHI, AKINORI;KOIZUMI, NAOYUKI;MURAYAMA, KEI |
分类号 |
H01L33/00;H01L33/50;H01L33/60;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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