发明名称 |
Multi-layer interconnection structure and manufacturing method thereof |
摘要 |
<p>Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.</p> |
申请公布号 |
EP2339624(A2) |
申请公布日期 |
2011.06.29 |
申请号 |
EP20090180912 |
申请日期 |
2009.12.29 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
YANG, YONG SUK;YOU, IN-KYU;KOO, JAE BON;NOH, YONG-YOUNG |
分类号 |
H01L23/498;H01L23/48;H05K3/10;H05K3/12;H05K3/40 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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