发明名称 CHEMICAL-MECHANICAL POLISHING LIQUID
摘要 <p>A chemical-mechanical polishing liquid is provided. The polishing liquid comprises abrasive particles, a polymer, water, as well as a stabilizer for improving the stability of the polishing slurry. In the polishing liquid,the growth rate of the particle size of the abrasive particles with time extended is low. The chemical-mechanical polishing liquid has higher stability, longer storage time and service life.</p>
申请公布号 WO2011072493(A1) 申请公布日期 2011.06.23
申请号 WO2010CN02064 申请日期 2010.12.17
申请人 ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.;JING, JUDY, JIANFEN;CAI, BOJAN, XINYUAN 发明人 JING, JUDY, JIANFEN;CAI, BOJAN, XINYUAN
分类号 C09G1/02 主分类号 C09G1/02
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