摘要 |
<p>A chemical-mechanical polishing liquid is provided. The polishing liquid comprises abrasive particles, a polymer, water, as well as a stabilizer for improving the stability of the polishing slurry. In the polishing liquid,the growth rate of the particle size of the abrasive particles with time extended is low. The chemical-mechanical polishing liquid has higher stability, longer storage time and service life.</p> |
申请人 |
ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.;JING, JUDY, JIANFEN;CAI, BOJAN, XINYUAN |
发明人 |
JING, JUDY, JIANFEN;CAI, BOJAN, XINYUAN |