| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit element achieving reduction in a mounting error by facilitating recognition of a direction of the circuit element with a simple constitution. SOLUTION: In a deposition layer 33 provided between a connection pad 31a, which is a part of a plurality of connection pads 31a and 31b, and a substrate 32, wiring 33a on a protective coat 33c side is stacked directly on wiring 33b on a substrate 32 side. In a deposition layer 33 provided between the remainder of the plurality of connection pads 31a and 31b and the substrate 32, an insulating layer 33e is provided between two layers of the wiring 33a and 33b. Thus, it is configured such that a film thickness d<SB>1</SB>of the deposition layer 33 provided between the connection pad 31a and the substrate 32 is different from a film thickness d<SB>2</SB>of the deposition layer 33 provided between the plurality of connection pads 31b and the substrate 32 with each other, so that the deposition layers exhibit different colors with each other to be visually confirmed. COPYRIGHT: (C)2011,JPO&INPIT |
