| 摘要 |
PURPOSE: The fuse of a semiconductor device and a method for forming the same are provided to protect peripheral patterns from laser applied during a blowing process by absorbing the energy of the laser using voids or stepped parts. CONSTITUTION: An interlayer insulating film(102) is arranged on a semiconductor substrate, and a trench(108) is arranged on the upper side of the interlayer insulating film. An insulating film is arranged on the upper side of the interlayer insulating film with the trench. A metal wiring is formed on the upper side of the insulating film. A contact is in connection with both end parts of the metal wiring. A fuse wiring is in contact with the upper side of the contact. |
