| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet such that a fraction of a semiconductor wafer is unlikely to scatter during expanding of a stealth dicing method. SOLUTION: An adhesive sheet 10 for stealth dicing includes a base 1 and an adhesive layer 2 formed on one surface thereof. An electrostatic charge voltage at the stop of application is equal to or lower than 1,000 V when a voltage of 10,000 V is applied from the side of the adhesive layer 2 of the adhesive sheet 10 for 60 seconds, and a time of attenuation of the electrostatic charge voltage at the stop of application from the electrostatic charge voltage down to equal to or lower than a half of the electrostatic charge voltage is equal to or shorter than 1.0 second. COPYRIGHT: (C)2011,JPO&INPIT |
