| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal laminate that can be doubled in productivity thereof by symmetrically forming two core substrates above and below an insulating base material, can prevent the generation of waste since the insulating base material and carrier layers can be utilized as a bare substrate during manufacturing of a printed circuit board, and can be recycled, and to provide a method of manufacturing a core substrate using the same. <P>SOLUTION: The metal laminate according to the present invention includes: the insulating base material; the carrier layers of a metal material laminated on both surfaces of the insulating base material; and first metal thin films laminated on one surface of each of the carrier layers. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
