发明名称 Low OHMIC contacts containing germanium for gallium nitride or other nitride-based power devices
摘要 An apparatus includes a substrate, a Group III-nitride layer over the substrate, and an electrical contact over the Group III-nitride layer. The electrical contact includes a stack having multiple layers of conductive material, and at least one of the layers in the stack includes germanium. The layers in the stack may include a contact layer, where the contact layer includes aluminum copper. The stack could include a titanium or titanium alloy layer, an aluminum or aluminum alloy layer, and a germanium or germanium alloy layer. At least one of the layers in the stack could include an aluminum or titanium alloy having a germanium content between about 1% and about 5%.
申请公布号 US2011140173(A1) 申请公布日期 2011.06.16
申请号 US20100927948 申请日期 2010.11.30
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 RAMDANI JAMAL
分类号 H01L29/66;H01L21/20 主分类号 H01L29/66
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