| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet with which a semiconductor chip of micro size can be manufactured with good yield by a stealth dicing method. <P>SOLUTION: An adhesive sheet 10 for stealth dicing includes a base 1 and an adhesive layer 2 formed on one surface thereof, and the adhesive sheet 10 has a Young's modulus of 200 to 600 MPa at 23°C and the adhesive layer 2 has a storage modulus of 0.10 to 50 MPa at 23°C. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
