| 摘要 |
PROBLEM TO BE SOLVED: To enhance reliability of connection between a through electrode and a pad electrode. SOLUTION: The semiconductor device includes a semiconductor substrate which has one surface and the other surface opposed to the one surface, an insulating film provided on the one surface of the semiconductor substrate, a through hole penetrating the semiconductor substrate and insulating film, a resin film provided on an inner wall of the through hole and having a connection hole at a position overlapping the through hole in plan view, a wiring layer provided on the insulating film and having a first recess at a position overlapping the through hole in plan view, and the through electrode connected to the wiring layer and provided in the first recess and in the through hole via the resin film. COPYRIGHT: (C)2011,JPO&INPIT
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