| 摘要 |
An image pickup section picks up images of a pair of targets formed on a substrate with a cutting line interposed therebetween (S101). An extracting section extracts the targets from the images (S102). Then, a measuring section measures the distance d1 between the targets (S103). When a driving section presses a blade against the substrate (S104), the substrate is pressed by the blade to become warped and starts to break. Thus, the image pickup section picks up images of the targets again (S105), and the extracting section extracts the targets from the images (S106). The measuring section measures the distance d2 between the targets (S107). A determining section determines the cutting state of the substrate from the amount of change (d2-d1) of the distances between the targets (S108). Thereby, a method for cutting a substrate and a method for manufacturing electronic elements using the method are provided by which the cutting situation of the substrate can be judged at the time of cutting the substrate into chips by breaking. |
