发明名称 Multi-layered integrated circuit and apparatus with thermal management and method
摘要 A multi-layered semiconductor apparatus capable of producing at least 500 W of continuous power includes at least two device substrates arranged in a stack. Each of the at least two device substrates has a first side and a second side opposite to the first side, and each of the at least two device substrates is configured to produce an average power density higher than 100 W/cm2. A plurality of active devices are provided on the first side of each of the at least two device substrates. The plurality of active devices are radiatively coupled among the at least two device substrates. At least one of the at least two device substrates is structured to provide a plurality of cavities on its second side to receive corresponding ones of the plurality of active devices on the first side of an adjacent one of the at least two device substrates.
申请公布号 US7956381(B1) 申请公布日期 2011.06.07
申请号 US20080189739 申请日期 2008.08.11
申请人 HRL LABORATORIES, LLC 发明人 BREWER PETER D.;GUINN KEITH V.;LYNCH JONATHAN J.
分类号 H01L29/74 主分类号 H01L29/74
代理机构 代理人
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