IMPROVED PROCESS FOR BONDING REACTIVE ADHESIVES TO SUBSTRATES

摘要

The invention is a system, or kit, comprising i) a stable solution or dispersion of a catalyst for the curing of a reactive adhesive system; and in a separate part ii) an uncured reactive adhesive system wherein the catalyst of part i) accelerates the cure of the reactive adhesive system. The reactive adhesive system can be a one or two-part system. In another embodiment, the invention is a method of bonding a reactive adhesive to a substrate comprising: a) contacting a catalyst for the curing of the reactive adhesive in a volatile solvent with the surface of the substrate to which the adhesive will be bonded; b) allowing the volatile solvent to volatilize away; c) contacting a reactive adhesive with the surface treated in step a) and d) allowing the adhesive to cure. This process is performed in the absence of a primer and a film forming agent.