发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME |
摘要 |
<p>A semiconductor device and a method of producing the same, wherein a bonding member and a bonded member are bonded by means of brazing in a way such that no voids are left inside the bonding layer. The semiconductor device comprises a bonded member and a bonding member which is bonded to the bonded member by means of brazing. The bonded member is provided with a through hole which is open on the bonding surface with the bonding member, and a path communicating with the through hole is provided on at least one of the bonding surface of the bonding member with the bonded member or the bonding surface of the bonded member with the bonding member.</p> |
申请公布号 |
WO2011064873(A1) |
申请公布日期 |
2011.06.03 |
申请号 |
WO2009JP70008 |
申请日期 |
2009.11.27 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA;TAKETSUNA YASUJI;KAKIUCHI EISAKU;TATEBE KATSUHIKO;MORINO MASAHIRO;TAKENAGA TOMOHIRO |
发明人 |
TAKETSUNA YASUJI;KAKIUCHI EISAKU;TATEBE KATSUHIKO;MORINO MASAHIRO;TAKENAGA TOMOHIRO |
分类号 |
H01L23/40;H01L23/36 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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