发明名称 |
Chip-type electric double layer capacitor and method of manufacturing the same |
摘要 |
There is provided a chip-type electric double layer capacitor including: an exterior case having a housing space provided therein and formed of insulation resin; first and second external terminals buried in the exterior case, each having a plurality of first surfaces exposed to the housing space and a second surface exposed to an outside of the exterior case; and an electric double layer cell electrically connected to the plurality of first surfaces of the first and second external terminals exposed to the housing space. The chip-type electric double layer capacitor may be reduced in size and weight and increased in capacity. Also, the chip-type electric double layer capacitor allows for surface mounting without any additional structure and has low equivalent series resistance (ESR).
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申请公布号 |
US2011128673(A1) |
申请公布日期 |
2011.06.02 |
申请号 |
US20100662916 |
申请日期 |
2010.05.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SANG KYUN;JUNG CHANG RYUL;LEE SUNG HO;PARK DONG SUP;CHO YEONG SU |
分类号 |
H01G9/016;H01G9/155 |
主分类号 |
H01G9/016 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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