发明名称 Chip-type electric double layer capacitor and method of manufacturing the same
摘要 There is provided a chip-type electric double layer capacitor including: an exterior case having a housing space provided therein and formed of insulation resin; first and second external terminals buried in the exterior case, each having a plurality of first surfaces exposed to the housing space and a second surface exposed to an outside of the exterior case; and an electric double layer cell electrically connected to the plurality of first surfaces of the first and second external terminals exposed to the housing space. The chip-type electric double layer capacitor may be reduced in size and weight and increased in capacity. Also, the chip-type electric double layer capacitor allows for surface mounting without any additional structure and has low equivalent series resistance (ESR).
申请公布号 US2011128673(A1) 申请公布日期 2011.06.02
申请号 US20100662916 申请日期 2010.05.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE SANG KYUN;JUNG CHANG RYUL;LEE SUNG HO;PARK DONG SUP;CHO YEONG SU
分类号 H01G9/016;H01G9/155 主分类号 H01G9/016
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