SELF-ADHESIVE TAPE

摘要

PROBLEM TO BE SOLVED: To provide a self-adhesive tape for circuit protection upon semiconductor member polishing wherein polymerization reaction of the self-adhesive is generated by a small integrated light quantity of energy ray in a narrow wavelength region, which is cured to obtain peelability and which has long service life. SOLUTION: As the energy ray used for curing, a light source including a light ray having 350 to 400 nm wavelength region showing peak intensity and 10 to 30 nm half width of the peak intensity can be used. A self-adhesive component contains a (meth)acrylic acid ester-based copolymer and a thermosetting compound, and 15 to 35 pts.wt. photopolymerization initiator and 0.2 to 3 pts.wt. polymerization inhibitor are contained in 100 pts.wt. (meth)acrylate copolymer. When the light source is used, the self-adhesive tape is cured by 20 to 500 mJ/cm2integrated light quantity, self-adhesive force is lowered and self-adhesive force after irradiation with the energy ray is made to be≤10% of self-adhesive force before irradiation with the energy ray. COPYRIGHT: (C)2011,JPO&INPIT