| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a wafer capable of reducing chips generated in an annular reinforcement and capable of efficiently discharging a treatment liquid such as an etchant to the outside of the wafer. SOLUTION: The method for processing the wafer includes a device region forming a plurality of devices and an outer-peripheral excess region surrounding the device region on a surface. The method for processing the wafer includes a process positioning a cutting blade 28 including an outer-peripheral tapered surface 29 while the tapered surface 29 is directed toward the outer-peripheral excess region side at a corresponding place at the rear side corresponding to the outer edge of the device region, forming an annular groove while cutting in the cutting blade 28 as rotating a chuck table 18 and forming an annular outer-peripheral reinforcement forming an annular inner peripheral surface in the tapered surface inclined to inside of the radial direction toward the surface side from the rear side extensively over the whole rear-side outer periphery. The method for processing the wafer further includes a wafer grinding process forming a circular recess in the rear region ground until the rear region reaches at least the same depth as the bottom of the annular groove cut by the tapered outer-peripheral reinforcement forming process and surrounded by the annular outer-peripheral reinforcement including the tapered surface. COPYRIGHT: (C)2011,JPO&INPIT
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