| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion device which is improved in assembling workability and easily reducible in size. <P>SOLUTION: The power conversion device 1 has a semiconductor laminated unit 2 which is constituted by alternately laminating a semiconductor module 21 for constituting a part of a power conversion circuit and a cooling pipe 22 for cooling the semiconductor module 21, and a frame 3 for supporting the semiconductor laminated unit 2. The frame 3 has a support 31 which supports a one-end face 201 in the lamination direction of the semiconductor laminated unit 2. A leaf spring member 4 for pressing the semiconductor laminated unit 2 in the lamination direction is arranged at the other end face 202 in the lamination direction of the semiconductor laminated unit 2. The leaf spring 4 has a pair of fixed ends 41 fixed to the frame 3, and a pressing part 42 which presses the other end face 202 of the semiconductor laminated unit 2 between the pair of fixed ends 41. At least one of the pair of fixed ends 41 is fastened to the frame 3 with a screwing member (bolt 5) which is screwed into the lamination direction. <P>COPYRIGHT: (C)2011,JPO&INPIT |
