| 发明名称 |
EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS |
| 摘要 |
Disclosed is a low viscosity, low to no chloride containing epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of capillary underfill compositions.
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| 申请公布号 |
US2011122590(A1) |
申请公布日期 |
2011.05.26 |
| 申请号 |
US20100951291 |
申请日期 |
2010.11.22 |
| 申请人 |
DOW GLOBAL TECHNOLOGIES INC. |
发明人 |
WILSON MARK B.;POTISEK STEPHANIE L. |
| 分类号 |
H05K7/00;B23K31/02;C08L63/00 |
主分类号 |
H05K7/00 |
| 代理机构 |
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