| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composition for sealing a semiconductor, which enables the formation of a thin resin layer, can prevent the diffusion of a metallic component into a porous interlayer insulating layer, and has excellent adhesion to wiring materials. <P>SOLUTION: A resin having two or more cationic functional groups and having a weight average molecular weight of 2,000 to 100,000 is added to the semiconductor-sealing composition having both a sodium content and a potassium content of 10 ppb by weight or less in terms of the element contents. The composition has a volume average particle size of 10 nm or less as measured by a dynamic light scattering method. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
