发明名称 Liquid-cooled semiconductor assembly
摘要 1,039,508. Cooling systems for semi-conductor devices. BROWN, BOVERI & CO. Ltd. June 17, 1965 [June 19, 1964], No. 25626/65. Heading H1K. A plurality of semi-conductor elements having cooling means are mounted in an electrically insulating plate which forms at least one side of a conductive container in which container a cooling liquid flows around the cooling means. In Fig. 2, a conductive container 1 has a face-plate 2 of non-conductive material which has set therein semi-conductor devices 4 each of which has a series of fins projecting into the container 1, the fins being covered with an insulating coating. The container is filled with a cooling fluid which can flow into radiators 5 and be air-cooled therein. The radiators may be replaced by a forced circulation cooling system.
申请公布号 GB1039508(A) 申请公布日期 1966.08.17
申请号 GB19650025626 申请日期 1965.06.17
申请人 BROWN, BOVERI & COMPANY LIMITED 发明人
分类号 H01L23/473 主分类号 H01L23/473
代理机构 代理人
主权项
地址