Method for analysis of semiconductor wafer during production of solar cells, involves recording image of textured surface region of wafer surface, and evaluating image for characterization of crystalline assembly of wafer

摘要

The method involves providing a semiconductor wafer with an unpolished wafer surface that has average surface roughness of 0.5 micro meters or quadratic surface roughness of 0.6 micrometers. A surface region of the wafer surface is textured by a texturing process such that the surface region is formed for utilization as a textured light incident surface of a solar cell. An image of the textured surface region is recorded, and is evaluated for characterization of crystalline assembly of the wafer.