| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit device which can prevent the bridge of solder balls with different potentials well. <P>SOLUTION: In an electronic circuit device 100, a part or all of a plurality of lands 111 which are adjacent with a common potential are unified with solder balls 130 by the integration of the lands 111 in the central region of at least one of the upper surface of a first electronic component 110 and the lower surface of a second electronic component 120. Thus, even if such a bend as to bring the central regions close to each other occurs in the first electronic component 110 and the second electronic component 120 by a reflow process, the solder balls 130 located there are unified. Consequently, the solder balls 130 are suppressed from expanding in all directions by being compressed in the vertical direction, so the bridge between the unified solder balls 130 in the central region and the solder balls 130 with different potentials in the circumference can be prevented well. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
