发明名称 MULTI LAYER THIN FILM FOR ENCAPSULATION AND THE METHOD THEREOF
摘要 <p>PURPOSE: An encapsulation film which is a multi layer thin film and manufacturing method thereof are provided to prevent damage of a device due to heat and ions, thereby increasing manufacture stability of a product. CONSTITUTION: An encapsulation film is a multi layer thin film. The encapsulation film comprises a protective layer(7), a barrier layer, and a mechanical protective layer. The protective layer is made from aluminium oxide. The barrier layer is made from single or double silicon nitride. A mechanical protective layer(8) is made from silicon dioxide. An aluminium oxide protective layer is formed using ozone as an oxidation source based on an ALD(Atomic layer deposition) method.</p>
申请公布号 KR20110049477(A) 申请公布日期 2011.05.12
申请号 KR20090106497 申请日期 2009.11.05
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 KANG, JAE WOOK;KIM, DO GEUN;CHOI, DONG KWON;JEONG, YONG SOO;KIM, JONG KUK
分类号 H01L51/56;H05B33/04 主分类号 H01L51/56
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