| 摘要 |
PROBLEM TO BE SOLVED: To reduce impedance of inductor wiring, and also reduce parasitic capacitance formed between the inductor wiring and a substrate or the like. SOLUTION: The inductor constituted on a substrate using multilayer wiring includes first inductor wiring 100 formed of a conductor layer ME(n) as an (n)th layer and second inductor wiring 200 electrically connected to the first inductor wiring 100 and formed of a conductor layer ME(n+1) as an (n+α)th layer (α: an integer equal to or larger than 1), wherein the first inductor wiring 100 is provided with no slit and the second inductor wiring 200 is provided with at least one slit SL1 along the extending direction of the second inductor wiring. COPYRIGHT: (C)2011,JPO&INPIT
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