发明名称 DEVICE HAVING AND METHOD FOR FORMING FINS WITH MULTIPLE WIDTHS
摘要 A method for fabrication of features for an integrated circuit includes patterning a mandrel layer to include structures having at least one width on a surface of an integrated circuit device. Exposed sidewalls of the structures are reacted to integrally form a new compound in the sidewalls such that the new compound extends into the exposed sidewalls by a controlled amount to form pillars. One or more layers below the pillars are etched using the pillars as an etch mask to form features for an integrated circuit device.
申请公布号 US2011108961(A1) 申请公布日期 2011.05.12
申请号 US20090614986 申请日期 2009.11.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG KANGGUO;DORIS BRUCE B.;HOLMES STEVEN J.;HUA XUEFENG;ZHANG YING
分类号 H01L29/06;H01L21/302 主分类号 H01L29/06
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