发明名称 |
DEVICE HAVING AND METHOD FOR FORMING FINS WITH MULTIPLE WIDTHS |
摘要 |
A method for fabrication of features for an integrated circuit includes patterning a mandrel layer to include structures having at least one width on a surface of an integrated circuit device. Exposed sidewalls of the structures are reacted to integrally form a new compound in the sidewalls such that the new compound extends into the exposed sidewalls by a controlled amount to form pillars. One or more layers below the pillars are etched using the pillars as an etch mask to form features for an integrated circuit device.
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申请公布号 |
US2011108961(A1) |
申请公布日期 |
2011.05.12 |
申请号 |
US20090614986 |
申请日期 |
2009.11.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHENG KANGGUO;DORIS BRUCE B.;HOLMES STEVEN J.;HUA XUEFENG;ZHANG YING |
分类号 |
H01L29/06;H01L21/302 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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