发明名称 BREAKING DEVICE AND BREAKING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a breaking device breaking a substrate with a break load smaller than before. <P>SOLUTION: The breaking device includes a table 12 on which a brittle material substrate is placed, a roller head 40 which rotatably supports a roller 32 brought into surface-contact with the substrate, and includes a vibration actuator 38 for applying vibrations in a pressure-contact direction in the pressure-contact state of the roller with the substrate, and a moving mechanism 22 for relatively moving the roller head along a substrate surface. The roller is set in a pressure-contact state along a pressure-contact schedule line positioned on the direct backside of the scribing line of a second surface which becomes a backside of a first surface, and moved, while applying vibrations in a pressure-contact direction, relatively to the brittle material substrate having a scribing line S formed in the first surface. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011088382(A) 申请公布日期 2011.05.06
申请号 JP20090244336 申请日期 2009.10.23
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MAEKAWA KAZUYA
分类号 B28D5/00;C03B33/033 主分类号 B28D5/00
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