| 发明名称 |
SUB-ASSEMBLY FOR USE IN FABRICATING PHOTO-ELECTROCHEMICAL DEVICES AND A METHOD OF PRODUCING A SUB-ASSEMBLY |
| 摘要 |
A sub assembly is disclosed for use in fabrication of photo-electrochemical devices including: a first layer which includes a semiconductor material; a second layer which is electrically conductive; and wherein the second layer supports the first layer. Methods of producing the sub assembly are also disclosed.
|
| 申请公布号 |
US2011101341(A1) |
申请公布日期 |
2011.05.05 |
| 申请号 |
US20090919616 |
申请日期 |
2009.02.25 |
| 申请人 |
DYESOL LTD. |
发明人 |
BELLON OLIVIER;TULLOCH SYLVIA MEDLYN |
| 分类号 |
H01L29/22;H01L21/283 |
主分类号 |
H01L29/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
