发明名称 |
Robust Joint Structure for Flip-Chip Bonding |
摘要 |
An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a copper bump at a main surface of the first work piece and having a first dimension; and a nickel-containing barrier layer over and adjoining the copper bump. The second work piece is bonded to the first work piece and includes a bond pad at a main surface of the second work piece; and a solder mask at the main surface of the second work piece and having a solder resist opening with a second dimension exposing a portion of the bond pad. A ratio of the first dimension to the second dimension is greater than about 1. Further, a solder region electrically connects the copper bump to the bond pad, with a vertical distance between the bond pad and the copper bump being greater than about 30 μm.
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申请公布号 |
US2011101519(A1) |
申请公布日期 |
2011.05.05 |
申请号 |
US20100842304 |
申请日期 |
2010.07.23 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HSIAO CHING-WEN;CHUANG YAO-CHUN;CHEN CHEN-SHIEN;KUO CHEN-CHENG;HUANG RU-YING |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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