| 摘要 |
PURPOSE: A printed circuit board for a package and manufacturing method thereof are provided to mount a light emitting device on a first metal layer functioning as a heat emitting layer, thereby enhancing heat emitting features. CONSTITUTION: A wiring board(100) is composed of a first metal layer(120), an insulating layer(130), and a second metal layer(140). A first cavity(110) is formed on the wiring board to mount a light emitting device. A reflective plate(300) forms a second cavity whose diameter is larger than the diameter of the first cavity. An adhesive sheet(200) is located between the wiring board and the reflective plate. The adhesive sheet forms a hole whose diameter is larger than the diameter of the first cavity. |
