发明名称 MULTI-PIECE BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A multi-piece board includes a frame and multiple wiring boards connected to the frame. The frame and each of the wiring boards are positioned with a clearance. The frame and/or each of the wiring boards has an end portion having a first notch portion on a surface side adjacent to the clearance. The end portion of the frame and/or each of the wiring boards has a second notch portion formed on the opposite surface side with respect to the surface side of the first notched portion adjacent to the clearance. The clearance between the frame and each of the wiring boards is filled with an adhesive agent.
申请公布号 US2011096517(A1) 申请公布日期 2011.04.28
申请号 US20100793170 申请日期 2010.06.03
申请人 IBIDEN CO., LTD. 发明人 YADA TAKAHIRO;YAMAZAKI TAKAHIRO;MUTO SUMIKI
分类号 H05K7/00;H05K3/00 主分类号 H05K7/00
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