发明名称 SUBSTRATE FOR ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK
摘要 An electrostatic chuck includes a metal base member and an insulating substrate having an opposite surface to an attraction surface joined onto the base member via an adhesive layer. In the substrate, an electrode layer to which a direct current voltage for attraction is applied is embedded in a portion of the substrate, close to the attraction surface. In addition, a plurality of independent RF electrode layers to which different radio frequencies for plasma control are fed, respectively, are embedded in portions of the substrate, at an opposite side of the first electrode layer to the attraction surface. The RF electrode layers are arranged separately in different layers which are not on an identical plane in such a manner as to partially overlap each other in a plan view.
申请公布号 US2011096461(A1) 申请公布日期 2011.04.28
申请号 US20100910493 申请日期 2010.10.22
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 YOSHIKAWA TADAYOSHI;TAMAGAWA KOKI;WATANABE NAOTO
分类号 H01L21/683 主分类号 H01L21/683
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